Semiconductor Reuse Startup Secures Seed Funding

Huanjingxin Technology, a novel player in semiconductor manufacturing services, has successfully closed a pre-seed funding round totaling tens of millions of RMB (approximately $6.87 million USD). The investment was spearheaded by Qifu Capital, with participation from Shengshi Investment, Haiyi Capital, and the Hunan University Student Entrepreneurship Investment Fund. These funds are earmarked for the construction of the company's initial high-volume manufacturing line in Wuxi, bolstering research and development initiatives, and strengthening working capital.

Founded in May 2025, Huanjingxin Technology distinguishes itself as the first domestic entity to propose a sustainable solution for the reuse of temporary bonding carrier boards. The company's founder, Zhang Jiyuan, brings a formidable background, including research experience from prestigious institutions like the Chinese Academy of Sciences, University of Science and Technology of China, and Harbin Institute of Technology, alongside prior experience at Huawei. His deep understanding of temporary bonding adhesives, cultivated under a mentor who pioneered domestic breakthroughs in this material, forms the bedrock of the company's innovative approach.

The critical need for Huanjingxin's technology arises from advanced semiconductor packaging processes. To handle ultra-thin wafers or components, temporary bonding adhesives are employed to affix them to rigid carrier boards. Post-processing, separating the wafer from the board presents a significant challenge due to the adhesive's extreme resistance to acids, alkalis, and high temperatures, making residue removal difficult. Current industry practices often lead to carrier board wastage, with many facilities discarding or storing single-use boards, representing a substantial cost inefficiency.

Huanjingxin's proprietary technology enables the lossless recycling and reuse of temporary bonding carrier boards, directly addressing the high auxiliary material costs in advanced packaging. This process is designed to preserve the integrity of the carrier board material, theoretically allowing for indefinite reuse. Post-treatment, the carrier boards exhibit surface cleanliness and flatness metrics comparable to new ones, a claim already validated by a leading domestic packaging manufacturer. This capability promises significant material cost reductions for clients.

The increasing demand for thinner and more powerful chips in AI, high-performance computing (HPC), and consumer electronics is driving the adoption of advanced packaging techniques like 2.5D/3D and wafer-level chip-scale packaging (WLCSP). These sophisticated processes inherently rely on temporary bonding technology, underscoring the market's growing need for solutions like Huanjingxin's. The company's first production line in Wuxi is set to commence operations this month, with a projected monthly capacity of 25,000 units, initiating client validation processes shortly thereafter.

Looking ahead, Huanjingxin aims to expand its service offerings beyond carrier board recycling. The company is developing a carbon-neutral laser debonding equipment, promising enhanced processing efficiency and yield improvements. Furthermore, in collaboration with Harbin Institute of Technology, they are pursuing domestic substitution research for critical semiconductor materials. This strategic vision positions Huanjingxin as a comprehensive service provider in the semiconductor industry, with plans to extend its operations from mainland China to Taiwan, Southeast Asia, and Korea.