Digital Phased Array Chip Firm Chensi Technology Gets Funding

宸思科技 (Chensi Technology), a Guangzhou-based innovator in digital phased array chip technology, has successfully closed a new funding round exclusively backed by 厦门高新投 (Xiamen High-Tech Investment). This capital infusion is earmarked for advancing core technology research and bolstering product pipelines, aiming to accelerate the development of its digital phased array chips and modules.

Founded in 2020, 宸思科技 distinguishes itself with a vertically integrated approach, encompassing chip design, module development, and end-product solutions. The company targets high-growth sectors such as the low-altitude economy, satellite internet, radar systems, and telemetry/tracking/command (TT&C) data links. This strategic focus aligns with the escalating demand for sophisticated communication and sensing technologies across these domains.

The company's technological cornerstone is its Digital Beamforming (DBF) chip, a critical component for digital phased array systems. 宸思科技 achieved mass production of its DBF chip in 2025, a significant milestone. Unlike traditional solutions relying on multiple Field-Programmable Gate Arrays (FPGAs), 宸思科技's single-chip design offers substantial advantages. It promises reduced hardware expenses, a dramatic decrease in power consumption from approximately 200 watts to a mere 20 watts, and a significantly smaller physical footprint. This high integration paves the way for more intelligent and energy-efficient digital phased array systems.

The market for phased array technology is experiencing robust expansion, driven by advancements in low-altitude aviation and the burgeoning satellite internet industry. Digital phased arrays, in particular, are recognized as the next generation of radar and wireless communication systems due to their superior beam control flexibility, enhanced performance, and advanced intelligence capabilities. Industry analysts project this market to reach hundreds of billions of yuan.

宸思科技's technical team boasts deep expertise, with its chief scientist having extensive experience in aerospace information and TT&C communications. The company's founder, 李钦昕 (Li Qinxin), previously led product lines for ZTE Microelectronics' mobile terminal chip design. The core engineering talent originates from prominent firms like 海思 (HiSilicon) and 中兴 (ZTE), bringing invaluable experience in the design and industrialization of large-scale communication chips.

The company's product strategy emphasizes versatility, high density, and miniaturization. By employing Application-Specific Integrated Circuits (ASICs) to replace FPGAs, 宸思科技 aims to deliver superior performance while minimizing power draw and module size. This approach makes their solutions adaptable to a wide array of applications, including spherical array antennas, planar array antennas, large-scale phased array radars, and ground stations for the low-altitude economy.

While the low-altitude economy is currently the primary commercial focus, with solutions being developed for monitoring applications, 宸思科技 is concurrently pursuing opportunities in satellite internet and radar/TT&C data links. The company has established preliminary customer relationships and strategic partnerships in these areas, with product deployments anticipated in the near future.